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Brief introduction
Fast Recovery Diode Modules , MZx400,Air Cooling,produced by TECHSEM .
VRRM |
Type & Outline |
600V 800V 1000V 1200V 1400V 1600V 1800V 1800V |
MZx400-06-410F3 MZx400-08-410F3 MZx400-10-410F3 MZx400-12-410F3 MZx400-14-410F3 MZx400-16-410F3 MZx400-18-410F3 MZ400-18-410F3G |
Features:
Typical Applications:
SYMBOL |
CHARACTERISTIC |
TEST CONDITIONS |
Tj(℃) |
VALUE |
UNIT |
||
Min |
Type |
Max |
|||||
IF(AV) |
Mean forward current |
180。half sine wave 50Hz Single side cooled, TC=85。C |
140 |
|
|
400 |
A |
IF (RMS) |
RMS forward current |
|
|
628 |
A |
||
IRRM |
Repetitive peak current |
at VRRM |
140 |
|
|
90 |
mA |
IFSM |
Surge forward current |
10ms half sine wave VR=0.6VRRM |
140 |
|
|
9.5 |
kA |
I2t |
I2t for fusing coordination |
|
|
451 |
103A2s |
||
VFO |
Threshold voltage |
|
140 |
|
|
1.10 |
V |
rF |
Forward slope resistance |
|
|
0.27 |
mΩ |
||
VFM |
Peak forward voltage |
IFM= 1200A |
25 |
|
|
2.00 |
V |
trr |
Reverse recovery time |
IFM=300A, tp=4000μs, -di/dt=20A/μs, VR=50V |
140 |
|
4 |
|
μs |
25 |
|
3 |
|
μs |
|||
Rth(j-c) |
Thermal resistance Junction to case |
Single side cooled per chip |
|
|
|
0.090 |
℃ /W |
Rth(c-h) |
Thermal resistance case to heatsink |
Single side cooled per chip |
|
|
|
0.020 |
℃ /W |
Viso |
Isolation voltage |
50Hz,R.M.S,t= 1min,Iiso:1mA(MAX) |
|
3000 |
|
|
V |
Fm |
Terminal connection torque(M12) |
|
|
12.0 |
|
14.0 |
N·m |
Mounting torque(M8) |
|
|
10.0 |
|
12.0 |
N·m |
|
Tvj |
Junction temperature |
|
|
-40 |
|
140 |
℃ |
Tstg |
Stored temperature |
|
|
-40 |
|
125 |
℃ |
Wt |
Weight |
|
|
|
3310 |
|
g |
Outline |
410F3 |
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