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MTx820,MFx820,Thyristor/Diode Modules,Air Cooling

820A,600V~1800V,416F3

  • Introduction
  • Outline
  • Equivalent Circuit Schematic
Introduction

Brief introduction

Thyristor/Diode module, MTx820 MFx820 MT800820A,Air coolingproduced by TECHSEM .

VRRM,VDRM

Type & Outline

600V

MTC820-06-416F3

MFC820-06-416F3

800V

MTC820-08-416F3

MFC820-08-416F3

1000V

MTC820-10-415F3

MFC820-10-416F3

1200V

MTC820-12-416F3

MFC820-12-416F3

1400V

MTC820-14-416F3

MFC820-14-416F3

1600V

MTC820-16-416F3

MFC820-16-416F3

1800V

MTC820-18-416F3

MFC820-18-416F3

1800V

MT820-18-416F3G

Features

  • Isolated mounting base 3000V~
  • Pressure contact technology with
  • Increased power cycling capability
  • Space and weight saving

Typical Applications

  • AC/DC Motor drives
  • Various rectifiers
  • DC supply for PWM inverte

SYMBOL

CHARACTERISTIC

TEST CONDITIONS

Tj(℃)

VALUE

UNIT

Min

Type

Max

IT(AV)

Mean on-state current

180°half sine wave 50Hz Single side cooled, Tc=85℃

135

820

A

IT(RMS)

RMS on-state current

180half sine wave 50Hz

1287

A

IDRM IRRM

Repetitive peak current

at VDRM at VRRM

135

120

mA

ITSM

Surge on-state current

10ms half sine wave, VR=0V

135

20.1

kA

I2t

I2t for fusing coordination

2020

A2s* 103

VTO

Threshold voltage

135

0.81

V

rT

On-state slope resistance

0.24

mΩ

VTM

Peak on-state voltage

ITM= 1500A

25

1.38

V

dv/dt

Critical rate of rise of off-state voltage

VDM=67%VDRM

135

1000

V/μs

di/dt

Critical rate of rise of on-state current

Gate source 1.5A

tr ≤0.5μs Repetitive

135

200

A/μs

tgd

Gate controlled delay time

IG= 1A dig/dt=1A/μs

25

4

μs

tq

Circuit commutated turn-off time

ITM=800A, tp=2000µs, VR =50V dv/dt=20V/µs ,di/dt=-10A/µs

135

250

µs

IGT

Gate trigger current

VA= 12V, IA= 1A

25

30

250

mA

VGT

Gate trigger voltage

0.8

3.0

V

IH

Holding current

10

300

mA

IL

Latching current

IA=1A IG= 1A dig/dt=1A/μs tg=30us

25

1500

mA

VGD

Non-trigger gate voltage

VDM=67%VDRM

135

0.25

V

IGD

Non-trigger gate current

VDM=67%VDRM

135

5

mA

Rth(j-c)

Thermal resistance Junction to case

Single side cooled per chip

0.047

℃/W

Rth(c-h)

Thermal resistance case to heatsink

Single side cooled per chip

0.015

℃/W

Viso

Isolation voltage

50Hz,R.M.S,t= 1min,Iiso:1mA(MAX)

3000

V

Fm

Terminal connection torque(M10)

10.0

12.0

N·m

Mounting torque(M6)

4.5

6.0

N·m

Tvj

Junction temperature

-40

135

Tstg

Stored temperature

-40

125

Wt

Weight

1410

g

Outline

416F3

Outline

diode modulesair cooling-0

Equivalent Circuit Schematic

diode modulesair cooling-1

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