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Brief introduction
Welding Diode module,MDC110,110A,Air Cooling,produced by TECHSEM .
VRRM |
Type & Outline |
600V 800V 1000V 1200V 1400V 1600V 1800V |
MDC110-06-229H3 MDC110-08-229H3 MDC110-10-229H3 MDC110-12-229H3 MDC110-14-229H3 MDC110-16-229H3 MDC110-18-229H3 |
Features:
Typical Applications:
SYMBOL |
CHARACTERISTIC |
TEST CONDITIONS |
Tj(℃) |
VALUE |
UNIT |
||
Min |
Type |
Max |
|||||
IF(AV) |
Mean forward current |
180°half sine wave 50Hz Single side cooled, TC=100℃ |
150 |
|
|
110 |
A |
IF(RMS) |
RMS forward current |
|
|
173 |
A |
||
IRRM |
Repetitive peak current |
at VRRM |
150 |
|
|
8 |
mA |
IFSM |
Surge forward current |
VR=60%VRRM,,t= 10ms half sine, |
150 |
|
|
2.0 |
kA |
I2t |
I2t for fusing coordination |
|
|
20.0 |
103A2s |
||
VFO |
Threshold voltage |
|
150 |
|
|
0.80 |
V |
rF |
Forward slope resistance |
|
|
1.74 |
mΩ |
||
VFM |
Peak forward voltage |
IFM=330A |
25 |
|
|
1.55 |
V |
Rth(j-c) |
Thermal resistance Junction to case |
At 1800 sine. Single side cooled per chip |
|
|
|
0.35 |
℃/W |
Rth(c-h) |
Thermal resistance case to heatsink |
At 1800 sine. Single side cooled per chip |
|
|
|
0.20 |
℃/W |
Viso |
Isolation voltage |
50Hz,R.M.S,t= 1min,Iiso:1mA(MAX) |
|
3000 |
|
|
V |
Fm |
Terminal connection torque(M5) |
|
|
2.5 |
|
4 |
N·m |
Mounting torque(M6) |
|
|
4.5 |
|
6 |
N·m |
|
Tvj |
Junction temperature |
|
|
-40 |
|
150 |
℃ |
Tstg |
Stored temperature |
|
|
-40 |
|
125 |
℃ |
Wt |
Weight |
|
|
|
100 |
|
g |
Outline |
224H3 |
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