800V~1800V,407F2NA, 407F2NK
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Brief introduction
Diode Modules(Non-isolated Type) ,MD300,800V~1800V,produced by TECHSEM .
VRRM | Type & Outline | |
800V | MD300-08-407F2NA | MD300-08-407F2NK |
1000V | MD300-10-407F2NA | MD300-10-407F2NK |
1300V | MD300-12-407F2NA | MD300-12-407F2NK |
1400V | MD300-14-407F2NA | MD300-14-407F2NK |
1600V | MD300-16-407F2NA | MD300-16-407F2NK |
1800V | MD300-18-407F2NA | MD300-18-407F2NK |
Features：
Typical Applications：
SYMBOL |
CHARACTERISTIC |
TEST CONDITIONS | Tj(℃) | VALUE |
UNIT | ||
Min | Type | Max | |||||
IF(AV) | Mean forward current | 180°half sine wave 50Hz Single side cooled, TC=100℃ |
150 |
|
| 300 | A |
IF(RMS) | RMS forward current |
|
| 471 | A | ||
IRRM | Repetitive peak current | at VRRM | 150 |
|
| 10 | mA |
IFSM | Surge forward current | VR=60%VRRM, t=10ms half sine |
150 |
|
| 10 | kA |
I2t | I2t for fusing coordination |
|
| 500 | 103A2s | ||
VFO | Threshold voltage |
|
150 |
|
| 0.80 | V |
rF | Forward slope resistance |
|
| 0.64 | mΩ | ||
VFM | Peak forward voltage | IFM=900A | 25 |
|
| 1.50 | V |
Rth(j-c) | Thermal resistance Junction to case | Single side cooled per chip |
|
|
| 0.13 | ℃/W |
Rth(c-h) | Thermal resistance case to heatsink | Single side cooled per chip |
|
|
| 0.04 | ℃/W |
Fm | Terminal connection torque(M10) |
|
| 10 |
| 12 | N·m |
Mounting torque(M6) |
|
| 4.5 |
| 6.0 | N·m | |
Tvj | Junction temperature |
|
| -40 |
| 150 | ℃ |
Tstg | Stored temperature |
|
| -40 |
| 125 | ℃ |
Wt | Weight |
|
|
| 330 |
| g |
Outline | 407F2NA, 407F2NK | ||||||
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