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IGBT Module 1200V

IGBT Module 1200V

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GD400HTX120P4SD,IGBT Module,STARPOWER

1200V400A Package:P4

Brand:
STARPOWER
Spu:
GD400HTX120P4SD
  • Introduction
  • Outline
  • Equivalent Circuit Schematic
Introduction

Brief introduction

IGBT module,produced by STARPOWER. 1200V 400A.

Features

  • Low VCE(sat) Trench IGBT technology
  • Low switching losses
  • 10μs short circuit capability
  • VCE(sat) with positive temperature coefficient
  • Maximum junction temperature 175oC
  • Low inductance case
  • Fast & soft reverse recovery anti-parallel FWD
  • Isolated copper pinfin baseplate using DBC technology

Typical Applications

  • Hybrid and electric vehicle
  • Inverter for motor drive
  • Uninterruptible power supply

Absolute Maximum Ratings TF=25oC unless otherwise noted

Symbol

Description

Value

Unit

VCES

Collector-Emitter Voltage

1200

V

VGES

Gate-Emitter Voltage

±20

V

ICN

Implemented Collector Current

400

A

IC

Collector Current @ TF=25oC @ TF=75oC

400

300

A

ICM

Pulsed Collector Current tp=1ms

800

A

PD

Maximum Power Dissipation @ Tj=175oC

1500

W

IGBT

Diode

Symbol

Description

Value

Unit

VRRM

Repetitive Peak Reverse Voltage

1200

V

IFN

Implemented Forward Current

400

A

IF

Diode Continuous Forward Current

300

A

IFM

Diode Maximum Forward Current tp=1ms

800

A

Module

Symbol

Description

Value

Unit

Tjmax

Maximum Junction Temperature

175

oC

Tjop

Operating Junction Temperature

-40 to +150

oC

TSTG

Storage Temperature Range

-40 to +125

oC

VISO

Isolation Voltage RMS,f=50Hz,t=1min

2500

V

IGBT Characteristics TF=25oC unless otherwise noted

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

VCE(sat)

Collector to Emitter Saturation Voltage

IC=300A,VGE=15V, Tj=25oC

1.50

1.95

V

IC=300A,VGE=15V, Tj=125oC

1.60

IC=300A,VGE=15V, Tj=150oC

1.65

VGE(th)

Gate-Emitter Threshold Voltage

IC=16.0mA,VCE=VGE, Tj=25oC

5.3

5.8

6.3

V

ICES

Collector Cut-Off Current

VCE=VCES,VGE=0V, Tj=25oC

1.0

mA

IGES

Gate-Emitter Leakage Current

VGE=VGES,VCE=0V, Tj=25oC

400

nA

RGint

Internal Gate Resistance

0.5

Ω

Cies

Input Capacitance

VCE=25V,f=1MHz, VGE=0V

41.4

nF

Cres

Reverse Transfer Capacitance

1.16

nF

QG

Gate Charge

VGE=15V

3.11

μC

td(on)

Turn-On Delay Time

VCC=500V,IC=300A, RG=1.5Ω,VGE=±15V, Ls=25nH,Tj=25oC

223

ns

tr

Rise Time

32

ns

td(off)

Turn-Off Delay Time

354

ns

tf

Fall Time

228

ns

Eon

Turn-On Switching Loss

6.24

mJ

Eoff

Turn-Off Switching Loss

20.1

mJ

td(on)

Turn-On Delay Time

VCC=500V,IC=300A, RG=1.5Ω,VGE=±15V, Ls=25nH,Tj=125oC

229

ns

tr

Rise Time

36

ns

td(off)

Turn-Off Delay Time

411

ns

tf

Fall Time

344

ns

Eon

Turn-On Switching Loss

11.0

mJ

Eoff

Turn-Off Switching Loss

28.6

mJ

td(on)

Turn-On Delay Time

VCC=500V,IC=300A, RG=1.5Ω,VGE=±15V, Ls=25nH,Tj=150oC

231

ns

tr

Rise Time

38

ns

td(off)

Turn-Off Delay Time

421

ns

tf

Fall Time

352

ns

Eon

Turn-On Switching Loss

12.2

mJ

Eoff

Turn-Off Switching Loss

29.7

mJ

ISC

SC Data

tP≤10μs,VGE=15V,

Tj=150oC,VCC=900V, VCEM≤1200V

1600

A

Diode Characteristics TF=25oC unless otherwise noted

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

VF

Diode Forward Voltage

IF=300A,VGE=0V,Tj=25oC

1.35

1.80

V

IF=300A,VGE=0V,Tj=125oC

1.35

IF=300A,VGE=0V,Tj=150oC

1.35

Qr

Recovered Charge

VR=500V,IF=300A,

-di/dt=9700A/μs,VGE=-15V Ls=25nH,Tj=25oC

32.7

μC

IRM

Peak Reverse

Recovery Current

478

A

Erec

Reverse Recovery Energy

22.1

mJ

Qr

Recovered Charge

VR=500V,IF=300A,

-di/dt=8510A/μs,VGE=-15V Ls=25nH,Tj=125oC

45.9

μC

IRM

Peak Reverse

Recovery Current

522

A

Erec

Reverse Recovery Energy

32.7

mJ

Qr

Recovered Charge

VR=500V,IF=300A,

-di/dt=8250A/μs,VGE=-15V Ls=25nH,Tj=150oC

51.5

μC

IRM

Peak Reverse

Recovery Current

537

A

Erec

Reverse Recovery Energy

37.4

mJ

NTC Characteristics TF=25oC unless otherwise noted

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

R25

Rated Resistance

5.0

∆R/R

Deviation of R100

TC=100 oC,R100=493.3Ω

-5

5

%

P25

Power

Dissipation

20.0

mW

B25/50

B-value

R2=R25exp[B25/50(1/T2- 1/(298.15K))]

3375

K

B25/80

B-value

R2=R25exp[B25/80(1/T2- 1/(298.15K))]

3411

K

B25/100

B-value

R2=R25exp[B25/100(1/T2- 1/(298.15K))]

3433

K

Module Characteristics TF=25oC unless otherwise noted

Symbol

Parameter

Min.

Typ.

Max.

Unit

p

Pressure Drop Cooling Circuit

V/t=10.0dm3/min;TF=25oC;Cooling Fluid=50% Water/50% Ethylene Glycol

100

mbar

p

Maximum Pressure In Cooling Circuit

2.5

bar

LCE

Stray Inductance

14

nH

RCC’+EE’

Module Lead Resistance, Terminal to Chip

0.80

RthJF

Junction-to-Cooling Fluid (perIGBT) Junction-to-Cooling Fluid (per Diode)

0.100 0.125

K/W

M

Terminal Connection Torque, Screw M6 Mounting Torque, Screw M6

2.5 3.0

5.0 6.0

N.m

G

Weight of Module

1340

g

Outline

gd400htx120p4sdigbt modulestarpower-0

Equivalent Circuit Schematic

gd400htx120p4sdigbt modulestarpower-1

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