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IGBT Module 1200V

IGBT Module 1200V

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GD200FFY120C6S,IGBT Module,STARPOWER

1200V 200A

Brand:
STARPOWER
Spu:
GD200FFY120C6S
  • Introduction
  • Outline
  • Equivalent Circuit Schematic
Introduction

Brief introduction

IGBT module,produced by STARPOWER. 1200V 200A.

Features

  • Low VCE(sat) Trench IGBT technology
  • VCE(sat) with positive temperature coefficient
  • Low switching losses
  • Maximum junction temperature 175
  • Low inductance case
  • Fast & soft reverse recovery anti-parallel FWD
  • Isolated copper baseplate using DBC technology

Typical Applications

  • Uninterruptible power supply
  • Inductive heating
  • Welding machine

Absolute Maximum Ratings TC=25oC unless otherwise noted

IGBT

Symbol

Description

Values

Unit

VCES

Collector-Emitter Voltage

1200

V

VGES

Gate-Emitter Voltage

±20

V

IC

Collector Current @ TC=25oC

@ TC= 100oC

309

200

A

ICM

Pulsed Collector Current tp=1ms

400

A

PD

Maximum Power Dissipation @ T =175oC

1006

W

Diode

Symbol

Description

Values

Unit

VRRM

Repetitive Peak Reverse Voltage

1200

V

IF

Diode Continuous Forward Current

200

A

IFM

Diode Maximum Forward Current tp=1ms

400

A

Module

Symbol

Description

Values

Unit

Tjmax

Maximum Junction Temperature

175

oC

Tjop

Operating Junction Temperature

-40 to +150

oC

TSTG

Storage Temperature Range

-40 to +125

oC

VISO

Isolation Voltage RMS,f=50Hz,t=1min

2500

V

IGBT Characteristics TC=25oC unless otherwise noted

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

VCE(sat)

Collector to Emitter

Saturation Voltage

IC=200A,VGE=15V, Tj=25oC

1.70

2.15

V

IC=200A,VGE=15V, Tj=125oC

1.95

IC=200A,VGE=15V, Tj=150oC

2.00

VGE(th)

Gate-Emitter Threshold Voltage

IC=5.0mA,VCE=VGE, Tj=25oC

5.2

6.0

6.8

V

ICES

Collector Cut-Off

Current

VCE=VCES,VGE=0V,

Tj=25oC

1.0

mA

IGES

Gate-Emitter Leakage Current

VGE=VGES,VCE=0V, Tj=25oC

400

nA

RGint

Internal Gate Resistance

4.0

Ω

td(on)

Turn-On Delay Time

VCC=600V,IC=200A, RG= 1. 1Ω,VGE=±15V, Tj=25oC

150

ns

tr

Rise Time

32

ns

td(off)

Turn-Off Delay Time

330

ns

tf

Fall Time

93

ns

Eon

Turn-On Switching

Loss

11.2

mJ

Eoff

Turn-Off Switching

Loss

11.3

mJ

td(on)

Turn-On Delay Time

VCC=600V,IC=200A, RG= 1. 1Ω,VGE=±15V, Tj= 125oC

161

ns

tr

Rise Time

37

ns

td(off)

Turn-Off Delay Time

412

ns

tf

Fall Time

165

ns

Eon

Turn-On Switching

Loss

19.8

mJ

Eoff

Turn-Off Switching

Loss

17.0

mJ

td(on)

Turn-On Delay Time

VCC=600V,IC=200A, RG= 1. 1Ω,VGE=±15V, Tj= 150oC

161

ns

tr

Rise Time

43

ns

td(off)

Turn-Off Delay Time

433

ns

tf

Fall Time

185

ns

Eon

Turn-On Switching

Loss

21.9

mJ

Eoff

Turn-Off Switching

Loss

19.1

mJ

ISC

SC Data

tP≤10μs,VGE=15V,

Tj=150oC,VCC=900V, VCEM≤1200V

800

A

Diode Characteristics TC=25oC unless otherwise noted

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

VF

Diode Forward

Voltage

IF=200A,VGE=0V,Tj=25oC

1.65

2.10

V

IF=200A,VGE=0V,Tj= 125oC

1.65

IF=200A,VGE=0V,Tj= 150oC

1.65

Qr

Recovered Charge

VR=600V,IF=200A,

-di/dt=5400A/μs,VGE=- 15V Tj=25oC

17.6

μC

IRM

Peak Reverse

Recovery Current

228

A

Erec

Reverse Recovery Energy

7.7

mJ

Qr

Recovered Charge

VR=600V,IF=200A,

-di/dt=5400A/μs,VGE=- 15V Tj=125oC

31.8

μC

IRM

Peak Reverse

Recovery Current

238

A

Erec

Reverse Recovery Energy

13.8

mJ

Qr

Recovered Charge

VR=600V,IF=200A,

-di/dt=5400A/μs,VGE=- 15V Tj=150oC

36.6

μC

IRM

Peak Reverse

Recovery Current

247

A

Erec

Reverse Recovery Energy

15.2

mJ

NTC Characteristics TC=25oC unless otherwise noted

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

R25

Rated Resistance

5.0

ΔR/R

Deviation of R100

TC= 100 oC,R100=493.3Ω

-5

5

%

P25

Power

Dissipation

20.0

mW

B25/50

B-value

R2=R25exp[B25/50(1/T2-

1/(298.15K))]

3375

K

B25/80

B-value

R2=R25exp[B25/80(1/T2-

1/(298.15K))]

3411

K

B25/100

B-value

R2=R25exp[B25/100(1/T2-

1/(298.15K))]

3433

K

Module Characteristics TC=25oC unless otherwise noted

Symbol

Parameter

Min.

Typ.

Max.

Unit

LCE

Stray Inductance

21

nH

RCC’+EE’

Module Lead Resistance,Terminal to Chip

1.80

RthJC

Junction-to-Case (per IGBT)

Junction-to-Case (per Diode)

0.149

0.206

K/W

RthCH

Case-to-Heatsink (per IGBT)

Case-to-Heatsink (per Diode)

Case-to-Heatsink (per Module)

0.031

0.043

0.009

K/W

M

Mounting Screw:M6

3.0

6.0

N.m

G

Weight of Module

300

g

Outline

gd200ffy120c6sigbt modulestarpower-0

Equivalent Circuit Schematic

gd200ffy120c6sigbt modulestarpower-1

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