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Diode Modules,MDx160-08-229H3,MDx160-10-229H3,MDx160-12-229H3,MDx160-14-229H3,MDx160-16-229H3,MDx160-18-229H3
Features:
Typical Applications
VRSM |
VRRM |
Type & Outline |
900V |
800V |
MDx160-08-229H3 |
1100V |
1000V |
MDx160-10-229H3 |
1300V |
1200V |
MDx160-12-229H3 |
1500V |
1400V |
MDx160-14-229H3 |
1700V |
1600V |
MDx160-16-229H3 |
1900V |
1800V |
MDx160-18-229H3 |
SYMBOL |
CHARACTERISTIC |
TEST CONDITIONS |
Tj(°C) |
VALUE |
UNIT |
||
Min |
Type |
Max |
|||||
IF(AV) |
Mean forward current |
180° half sine wave 50Hz Single side cooled, TC=100°C |
150 |
|
|
160 |
A |
IF(RMS) |
RMS forward current |
|
|
251 |
A |
||
IRRM |
Repetitive peak current |
at VRRM |
150 |
|
|
12 |
mA |
IFSM |
Surge forward current |
10ms half sine wave VR=0.6VRRM |
150 |
|
|
4 |
kA |
I2t |
I2t for fusing coordination |
|
|
80 |
A2s*103 |
||
VFO |
Threshold voltage |
|
150 |
|
|
0.85 |
V |
rF |
Forward slope resistance |
|
|
1.25 |
mΩ |
||
VFM |
Peak forward voltage |
IFM=480A |
25 |
|
|
1.50 |
V |
Rth(j-c) |
Thermal resistance Junction to case |
Single side cooled per chip |
|
|
|
0.20 |
C /W |
Rth(c-h) |
Thermal resistance case to heatsink |
Single side cooled per chip |
|
|
|
0.08 |
C /W |
Viso |
Isolation voltage |
50Hz,R.M.S,t=1min, Iiso:1mA(max) |
|
3000 |
|
|
V |
Fm |
Terminal connection torque(M6) |
|
|
4.5 |
|
6 |
N·m |
Mounting torque(M6) |
|
|
4.5 |
|
6 |
N·m |
|
Tstg |
Stored temperature |
|
|
-40 |
|
125 |
°C |
Wt |
Weight |
|
|
|
165 |
|
g |
Outline |
229H3 |
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