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GD400SGU120C2S

IGBT Module,1200V 400A

Brand:
STARPOWER
Spu:
GD400SGU120C2S
  • Introduction
Introduction

Features

  • NPT IGBT technology
  • 10μs short circuit capability
  • Low switching losses
  • VCE(sat) with positive temperature coefficient
  • Low inductance case
  • Fast & soft reverse recovery anti-parallel FWD
  • Isolated copper baseplate using DBC technology

Typical Applications

  • Switching mode power supply
  • Inductive heating
  • Electronic welder

Absolute Maximum Ratings TC=25oC unless otherwise noted

 

IGBT

 

Symbol

Description

Value

Unit

VCES

Collector-Emitter Voltage

1200

V

VGES

Gate-Emitter Voltage

±20

V

IC

Collector Current  @ TC=25oC

@ TC=70oC

549

400

A

ICM

Pulsed Collector Current  tp=1ms

800

A

PD

Maximum Power Dissipation  @ T =150oC

2659

W

Diode

 

Symbol

Description

Value

Unit

VRRM

Repetitive Peak Reverse Voltage

1200

V

IF

Diode Continuous Forward Current

400

A

IFM

Diode Maximum Forward Current  tp=1ms

800

A

Module

 

Symbol

Description

Value

Unit

Tjmax

Maximum Junction Temperature

150

oC

Tjop

Operating Junction Temperature

-40 to +125

oC

TSTG

Storage Temperature Range

-40 to +125

oC

VISO

Isolation Voltage  RMS,f=50Hz,t=1min

2500

V

IGBT Characteristics TC=25oC unless otherwise noted

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

 

VCE(sat)

Collector to Emitter

Saturation Voltage

IC=400A,VGE=15V, Tj=25oC

 

2.90

3.35

 

V

IC=400A,VGE=15V, Tj=125oC

 

3.60

 

VGE(th)

Gate-Emitter Threshold Voltage

IC= 16.0mA,VCE=VGE, Tj=25oC

4.5

5.5

6.5

V

ICES

Collector Cut-Off

Current

VCE=VCES,VGE=0V,

Tj=25oC

 

 

5.0

mA

IGES

Gate-Emitter Leakage Current

VGE=VGES,VCE=0V, Tj=25oC

 

 

400

nA

RGint

Internal Gate Resistance

 

 

0.6

 

Ω

Cies

Input Capacitance

VCE=25V,f=1MHz,

VGE=0V

 

26.0

 

nF

Cres

Reverse Transfer

Capacitance

 

1.70

 

nF

QG

Gate Charge

VGE=- 15…+15V

 

4.2

 

μC

td(on)

Turn-On Delay Time

 

 

VCC=600V,IC=400A,  RG=2.2Ω,

VGE=±15V, Tj=25oC

 

76

 

ns

tr

Rise Time

 

57

 

ns

td(off)

Turn-Off Delay Time

 

529

 

ns

tf

Fall Time

 

73

 

ns

Eon

Turn-On Switching

Loss

 

5.2

 

mJ

Eoff

Turn-Off Switching

Loss

 

23.2

 

mJ

td(on)

Turn-On Delay Time

 

 

VCC=600V,IC=400A,RG=2.2Ω,

VGE=±15V, Tj= 125oC

 

81

 

ns

tr

Rise Time

 

62

 

ns

td(off)

Turn-Off Delay Time

 

567

 

ns

tf

Fall Time

 

81

 

ns

Eon

Turn-On Switching

Loss

 

9.9

 

mJ

Eoff

Turn-Off Switching

Loss

 

31.7

 

mJ

 

ISC

 

SC Data

tP≤10μs,VGE=15V,

Tj=125oC,VCC=900V, VCEM≤1200V

 

 

2800

 

 

A

Diode Characteristics TC=25oC unless otherwise noted

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

VF

Diode Forward

Voltage

IF=400A,VGE=0V,Tj=25oC

 

1.96

2.31

V

IF=400A,VGE=0V,Tj= 125oC

 

1.98

 

Qr

Recovered Charge

VR=600V,IF=400A,

-di/dt=6000A/μs,VGE=- 15V Tj=25oC

 

24.9

 

μC

IRM

Peak Reverse

Recovery Current

 

317

 

A

Erec

Reverse Recovery Energy

 

16.0

 

mJ

Qr

Recovered Charge

VR=600V,IF=400A,

-di/dt=6000A/μs,VGE=- 15V Tj= 125oC

 

35.5

 

μC

IRM

Peak Reverse

Recovery Current

 

391

 

A

Erec

Reverse Recovery Energy

 

21.4

 

mJ

 

 

Module Characteristics TC=25oC unless otherwise noted

 

Symbol

Parameter

Min.

Typ.

Max.

Unit

LCE

Stray Inductance

 

 

20

nH

RCC’+EE’

Module Lead Resistance, Terminal to Chip

 

0.18

 

RthJC

Junction-to-Case (per IGBT)

Junction-to-Case (per Diode)

 

 

0.047

0.100

K/W

 

RthCH

Case-to-Heatsink (per IGBT)

Case-to-Heatsink (per Diode)

Case-to-Heatsink (per Module)

 

0.015

0.031

0.010

 

K/W

M

Terminal Connection Torque, Screw M6 Mounting Torque, Screw M6

2.5

3.0

 

5.0

5.0

N.m

G

Weight of Module

 

300

 

g

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