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GD400SGT170C2S

IGBT Module,1700V 400A

Brand:
STARPOWER
Spu:
GD400SGT170C2S
  • Introduction
Introduction

Features

  • Low VCE(sat) trench IGBT technology
  • Low switching losses
  • 10μs short circuit capability
  • VCE(sat) with positive temperature coefficient
  • Low inductance case
  • Fast & soft reverse recovery anti-parallel FWD
  • Isolated copper baseplate using DBC technology

 

 

Typical Applications

  • AC inverter drives
  • Switching mode power supplies

Absolute Maximum Ratings TC=25 unless otherwise noted

7

Symbol

Description

GD400SGT170C2S

Units

VCES

Collector-Emitter Voltage

1700

V

VGES

Gate-Emitter Voltage

±20

V

IC

Collector Current    @ TC=25

@ TC=80

700

A

400

ICM(1)

Pulsed Collector Current    tp=1ms

800

A

IF

Diode Continuous Forward Current

400

A

IFM

Diode Maximum Forward Current

800

A

PD

Maximum Power Dissipation @ Tj= 175

3000

W

TSC

Short Circuit Withstand Time @ Tj=125

10

μs

Tjmax

Maximum Junction Temperature

175

TSTG

Storage Temperature Range

-40 to +125

I2t-value,Diode

VR=0V,t=10ms,Tj=125

25500

A2s

VISO

Isolation Voltage    RMS,f=50Hz,t=1min

4000

V

 

Mounting Torque

Power Terminal Screw:M4

Power Terminal Screw:M6

1.1 to 2.0

2.5 to 5.0

N.m

Mounting Screw:M6

3.0 to 5.0

N.m

0C2S

Electrical Characteristics of IGBT TC=25 unless otherwise noted

Off Characteristics

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

V(BR)CES

Collector-Emitter

Breakdown Voltage

VGE=0V, IC= 14mA, Tj=25

1700

 

 

V

ICES

Collector Cut-Off Current

VCE=VCES,VGE=0V, Tj=25

 

 

3.0

mA

IGES

Gate-Emitter Leakage

Current

VGE=VGES,VCE=0V, Tj=25

 

 

400

nA

On Characteristics

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

VGE(th)

Gate-Emitter Threshold

Voltage

IC= 16mA,VCE=VGE, Tj=25

5.2

5.8

6.4

V

 

 

VCE(sat)

 

Collector to Emitter

Saturation Voltage

IC=400A,VGE=15V, Tj=25

 

2.00

2.45

 

 

V

IC=400A,VGE=15V, Tj= 125

 

2.40

 

Switching Characteristics

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

td(on)

Turn-On Delay Time

VCC=900V,IC=400A,

 

278

 

ns

tr

Rise Time

RG=3.6Ω,VGE= ±15 V,

 

81

 

ns

td(off)

Turn-Off Delay Time

Tj=25

 

802

 

ns

tf

Fall Time

 

VCC=900V,IC=400A,   RG=3.6Ω,VGE= ±15 V, Tj=25

 

119

 

ns

Eon

Turn-On Switching

Loss

 

104

 

mJ

Eoff

Turn-Off Switching

Loss

 

86

 

mJ

td(on)

Turn-On Delay Time

 

 

 

VCC=900V,IC=400A,   RG=3.6Ω,VGE= ±15 V, Tj= 125

 

302

 

ns

tr

Rise Time

 

99

 

ns

td(off)

Turn-Off Delay Time

 

1002

 

ns

tf

Fall Time

 

198

 

ns

Eon

Turn-On Switching

Loss

 

136

 

mJ

Eoff

Turn-Off Switching

Loss

 

124

 

mJ

Cies

Input Capacitance

 

VCE=25V,f=1MHz,

VGE=0V

 

36

 

nF

Coes

Output Capacitance

 

1.5

 

nF

Cres

Reverse Transfer

Capacitance

 

1.2

 

nF

 

ISC

 

SC Data

tSC10μs,VGE=15V,

Tj=125,VCC= 1000V, VCEM1700V

 

 

1600

 

 

A

RGint

Internal Gate Resistance

 

 

1.9

 

Ω

LCE

Stray Inductance

 

 

 

20

nH

RCC’+EE 

Module Lead Resistance, Terminal to Chip

TC=25

 

0.18

 

mΩ

Electrical Characteristics of DIODE TC=25 unless otherwise noted

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

VF

Diode Forward

Voltage

IF=400A

Tj=25

 

1.80

2.20

V

Tj= 125

 

1.90

 

Qr

Diode Reverse

Recovery Charge

 

IF=400A,

VR=900 V,

di/dt=-4250A/μs, VGE=- 15V

Tj=25

 

99

 

μC

Tj= 125

 

172

 

 

IRM

Diode Peak

Reverse  Recovery Current

Tj=25

 

441

 

 

A

Tj= 125

 

478

 

Erec

Reverse  Recovery Energy

Tj=25

 

53

 

mJ

Tj= 125

 

97

 

Thermal Characteristics

 

Symbol

Parameter

Typ.

Max.

Units

RθJC

Junction-to-Case (IGBT Part, per Module)

 

0.05

K/W

RθJC

Junction-to-Case (DIODE Part, per Module)

 

0.09

K/W

RθCS

Case-to-Sink (Conductive grease applied)

0.035

 

K/W

Weight

Weight of Module

300

 

g

 

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