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GD400SGK120C2S

IGBT Module,1200V 400A

Brand:
STARPOWER
Spu:
GD400SGK120C2S
  • Introduction
Introduction

Features

  • Low VCE(sat) non punch through IGBT technology
  • 10μs short circuit capability
  • VCE(sat) with positive temperature coefficient
  • Latch-up free
  • Low inductance case
  • Fast & soft reverse recovery anti-parallel FWD
  • Isolated copper baseplate using DBC technology

Typical Applications

  • UPS
  • Switching mode power supplies
  • Electronic welders at fSW up to 25kHz

Absolute Maximum Ratings TC=25 unless otherwise noted

 

Symbol

Description

GD400SGK120C2S

Units

VCES

Collector-Emitter Voltage

1200

V

Symbol

Description

GD400SGK120C2S

Units

VGES

Gate-Emitter Voltage

±20V

V

IC

Collector Current    @ TC=25

@ TC=80

550

A

400

ICM(1)

Pulsed Collector Current    tp=1ms

800

A

IF

Diode Continuous Forward Current

400

A

IFM

Diode Maximum Forward Current

800

A

PD

Maximum power Dissipation @ Tj=150

2500

W

TSC

Short Circuit Withstand Time @ Tj=125

10

μs

Tj

Operating Junction Temperature

-40 to +150

TSTG

Storage Temperature Range

-40 to +125

I2t-value, Diode

VR=0V, t=10ms, Tj=125

27500

A2s

VISO

Isolation Voltage    RMS, f=50Hz, t=1min

2500

V

Mounting

Torque

Power Terminal Screw:M4

Power Terminal Screw:M6

1.1 to 2.0

2.5 to 5.0

N.m

Mounting Screw:M6

3.0 to 6.0

N.m

Electrical Characteristics of IGBT TC=25 unless otherwise noted

Off Characteristics

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

BVCES

Collector-Emitter

Breakdown Voltage

Tj=25

1200

 

 

V

ICES

Collector Cut-Off Current

VCE=VCES,VGE=0V, Tj=25

 

 

5.0

mA

IGES

Gate-Emitter Leakage

Current

VGE=VGES,VCE=0V, Tj=25

 

 

400

nA

On Characteristics

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

VGE(th)

Gate-Emitter

Threshold Voltage

IC=5.0mA,VCE=VGE,

Tj=25

4.5

5.1

5.5

V

 

VCE(sat)

Collector to Emitter

Saturation Voltage

IC=400A,VGE=15V,Tj=25

 

2.2

 

 

V

IC=400A,VGE=15V,

Tj=125

 

2.5

 

Switching Characteristics

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

td(on)

Turn-On Delay Time

VCC=600V,IC=400A,

 

258

 

ns

tr

Rise Time

RG=3.3Ω, VGE =±15V,

 

110

 

ns

td(off)

Turn-Off Delay Time

Tj= 25

 

285

 

ns

tf

Fall Time

 

VCC=600V,IC=400A,

RG=3.3Ω, VGE =±15V, Tj= 25

 

70

 

ns

Eon

Turn-On Switching Loss

 

45

 

mJ

Eoff

Turn-Off Switching Loss

 

26

 

mJ

td(on)

Turn-On Delay Time

 

 

 

VCC=600V,IC=400A,

RG=3.3Ω, VGE =±15V, Tj= 125

 

260

 

ns

tr

Rise Time

 

120

 

ns

td(off)

Turn-Off Delay Time

 

300

 

ns

tf

Fall Time

 

80

 

ns

Eon

Turn-On Switching Loss

 

60

 

mJ

Eoff

Turn-Off Switching Loss

 

40

 

mJ

Cies

Input Capacitance

 

VCE =25V, f=1.0MHz,

VGE =0V

 

74.7

 

nF

Coes

Output Capacitance

 

3.3

 

nF

Cres

Reverse Transfer

Capacitance

 

0.64

 

nF

 

ISC

 

SC Data

tSC10μs, VGE=15V,

Tj=125, VCC=900V,

VCEM 1200V

 

 

2400

 

 

A

LCE

Stray Inductance

 

 

16

 

nH

 

RCC’+EE

Module lead

resistance, terminal to chip

 

TC=25

 

 

0.50

 

 

mΩ

Electrical Characteristics of DIODE TC=25 unless otherwise noted

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

VF

Diode Forward

Voltage

IF=400A

Tj=25

 

2.0

2.3

V

Tj=125

 

2.2

2.5

Qr

Diode Reverse

Recovery Charge

 

 

IF=400A,

VR=600V,

di/dt=-4100A/μs, VGE=-15V

Tj=25

 

31

 

μC

Tj=125

 

66

 

 

IRM

Diode Peak

Reverse  Recovery Current

Tj=25

 

300

 

 

A

Tj=125

 

410

 

Erec

Reverse Recovery Energy

Tj=25

 

12

 

mJ

Tj=125

 

28

 

Thermal Characteristics

 

Symbol

Parameter

Typ.

Max.

Units

RθJC

Junction-to-Case (IGBT Part, per 1/2 Module)

 

0.05

K/W

RθJC

Junction-to-Case (DIODE Part, per 1/2 Module)

 

0.08

K/W

RθCS

Case-to-Sink (Conductive grease applied)

0.035

 

K/W

Weight

Weight of Module

340

 

g

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