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GD400HFT170C2SN

IGBT Module,1700V 400A

Brand:
STARPOWER
Spu:
GD400HFT170C2SN
  • Introduction
Introduction

Features

  • Low VCE(sat) trench IGBT technology
  • Low switching loss
  • 10μs short circuit capability
  • Low inductance case
  • VCE(sat) with positive temperature coefficient
  • Fast & soft reverse recovery anti-parallel FWD
  • Isolated copper baseplate using DBC technology

Typical Applications

  • AC inverter drives
  • Switching mode power supplies
  • UPS

Absolute Maximum Ratings TC=25 unless otherwise noted

Symbol

Description

GD400HFT170C2SN

Units

VCES

Collector-Emitter Voltage

1700

V

VGES

Gate-Emitter Voltage

±20

V

IC

Collector Current  @ TC=25

@ TC=80

700

400

A

ICM

Pulsed Collector Current  tp=1ms

800

A

IF

Diode Continuous Forward Current

@ TC=80

400

A

IFM

Diode Maximum Forward Current  tp=1ms

800

A

PD

Maximum Power Dissipation  @ Tj=175

2632

W

Tjmax

Maximum Junction Temperature

175

TSTG

Storage Temperature Range

-40 to +125

VISO

Isolation Voltage  RMS,f=50Hz,t=1min

4000

V

Mounting Torque

Power Terminal Screw:M6

Mounting Screw:M6

2.5 to 5.0

3.0 to 5.0

N.m

Electrical Characteristics of IGBT TC=25 unless otherwise noted

Off Characteristics

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

V(BR)CES

Collector-Emitter

Breakdown Voltage

Tj=25

1700

 

 

V

ICES

Collector Cut-Off

Current

VCE=VCES,VGE=0V, Tj=25

 

 

5.0

mA

IGES

Gate-Emitter Leakage Current

VGE=VGES,VCE=0V, Tj=25

 

 

400

nA

On Characteristics

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

VGE(th)

Gate-Emitter Threshold Voltage

IC= 16.0mA,VCE=VGE, Tj=25

5.2

5.8

6.4

V

 

VCE(sat)

 

Collector to Emitter

Saturation Voltage

IC=400A,VGE=15V, Tj=25

 

2.00

2.45

 

V

IC=400A,VGE=15V, Tj=125

 

2.40

 

Switching Characteristics

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

td(on)

Turn-On Delay Time

 

 

VCC=900V,IC=400A,  RG=3.6Ω,VGE=±15V, Tj=25

 

281

 

ns

tr

Rise Time

 

79

 

ns

td(off)

Turn-Off Delay Time

 

795

 

ns

tf

Fall Time

 

120

 

ns

Eon

Turn-On Switching

Loss

 

104

 

mJ

Eoff

Turn-Off Switching

Loss

 

86

 

mJ

td(on)

Turn-On Delay Time

 

 

VCC=900V,IC=400A,  RG=3.6Ω,VGE=±15V, Tj=125

 

299

 

ns

tr

Rise Time

 

102

 

ns

td(off)

Turn-Off Delay Time

 

998

 

ns

tf

Fall Time

 

202

 

ns

Eon

Turn-On Switching

Loss

 

136

 

mJ

Eoff

Turn-Off Switching

Loss

 

124

 

mJ

Cies

Input Capacitance

VCE=25V,f=1MHz,

VGE=0V

 

35.3

 

nF

Coes

Output Capacitance

 

1.46

 

nF

Cres

Reverse Transfer

Capacitance

 

1.17

 

nF

 

ISC

 

SC Data

tP≤10μs,VGE=15 V,

Tj=125℃,VCC= 1000 V, VCEM≤1700V

 

 

1600

 

 

A

RGint

Internal Gate Resistance

 

 

1.9

 

Ω

LCE

Stray Inductance

 

 

 

20

nH

 

RCC’+EE’

Module Lead

Resistance,

Terminal To Chip

 

 

 

0.35

 

 

Electrical Characteristics of DIODE TC=25 unless otherwise noted

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

VF

Diode Forward

Voltage

IF=400A

Tj=25

 

1.80

2.20

V

Tj=125

 

1.90

 

Qr

Recovered

Charge

IF=400A,

VR=900V,

RG=3.6Ω,

VGE=-15V

Tj=25

 

100

 

μC

Tj=125

 

170

 

IRM

Peak Reverse

Recovery Current

Tj=25

 

440

 

A

Tj=125

 

480

 

Erec

Reverse Recovery Energy

Tj=25

 

54.0

 

mJ

Tj=125

 

95.0

 

Thermal Characteristics

Symbol

Parameter

Typ.

Max.

Units

RθJC

Junction-to-Case (per IGBT)

 

0.057

K/W

RθJC

Junction-to-Case (per DIODE)

 

0.110

K/W

RθCS

Case-to-Sink (Conductive grease applied)

0.035

 

K/W

Weight

Weight     Module

300

 

g

 

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