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GD400HFT120C2SN_T4F

IGBT Module,1200V 400A

Brand:
STARPOWER
Spu:
GD400HFT120C2SN_T4F
  • Introduction
Introduction

Features

  • Low VCE(sat) Trench IGBT technology
  • Low switching loss
  • 10μs short circuit capability
  • Low inductance case
  • VCE(sat) with positive temperature coefficient
  • Fast & soft reverse recovery anti-parallel FWD
  • Isolated copper baseplate using DBC technology

Typical Applications

  • Switching mode power supply
  • Inductive heating
  • Welding machine

Absolute Maximum Ratings TC=25 unless otherwise noted

 

Symbol

Description

GD400HFT120C2SN_T4F

Units

VCES

Collector-Emitter Voltage

1200

V

VGES

Gate-Emitter Voltage

±20

V

IC

Collector Current  @ TC=25

@ TC=90

585

400

A

ICM

Pulsed Collector Current  tp=1ms

800

A

IF

Diode Continuous Forward Current

400

A

IFM

Diode Maximum Forward Current tp=1ms

800

A

PD

Maximum Power Dissipation

@ Tj=175

2174

W

Tjmax

Maximum Junction Temperature

175

Tjop

Operating Junction Temperature

-40 to +150

TSTG

Storage Temperature Range

-40 to +125

VISO

Isolation Voltage  RMS,f=50Hz,t=1min

4000

V

Mounting Torque

Power Terminal Screw:M6

Mounting Screw:M6

2.5 to 5.0

3.0 to 5.0

N.m

Weight

Weight of Module

300

g

 

 

 

Electrical Characteristics of IGBT TC=25 unless otherwise noted

Off Characteristics

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

V(BR)CES

Collector-Emitter

Breakdown Voltage

Tj=25

1200

 

 

V

ICES

Collector Cut-Off

Current

VCE=VCES,VGE=0V, Tj=25

 

 

5.0

mA

IGES

Gate-Emitter Leakage Current

VGE=VGES,VCE=0V, Tj=25

 

 

400

nA

On Characteristics

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

VGE(th)

Gate-Emitter Threshold Voltage

IC= 15.2mA,VCE=VGE, Tj=25

5.1

5.8

6.4

V

 

VCE(sat)

 

Collector to Emitter

Saturation Voltage

IC=400A,VGE=15V, Tj=25

 

2.05

2.45

 

V

IC=400A,VGE=15V, Tj=125

 

2.40

 

Switching Characteristics

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

td(on)

Turn-On Delay Time

 

 

VCC=600V,IC=400A,  RG=2.4Ω,

VGE=±15V, Tj=25

 

362

 

ns

tr

Rise Time

 

112

 

ns

td(off)

Turn-Off Delay Time

 

378

 

ns

tf

Fall Time

 

115

 

ns

Eon

Turn-On Switching

Loss

 

34.8

 

mJ

Eoff

Turn-Off Switching

Loss

 

19.0

 

mJ

td(on)

Turn-On Delay Time

 

 

VCC=600V,IC=400A,  RG=2.4Ω,

VGE=±15V, Tj= 125

 

364

 

ns

tr

Rise Time

 

113

 

ns

td(off)

Turn-Off Delay Time

 

405

 

ns

tf

Fall Time

 

125

 

ns

Eon

Turn-On Switching

Loss

 

43.0

 

mJ

Eoff

Turn-Off Switching

Loss

 

30.8

 

mJ

Cies

Input Capacitance

VCE=25V,f=1MHz,

VGE=0V

 

24.6

 

nF

Cres

Reverse Transfer

Capacitance

 

1.38

 

nF

 

ISC

SC Data

tP≤10μs,VGE=15 V,

Tj=125℃,VCC=900V, VCEM≤1200V

 

1600

 

A

RGint

Internal Gate Resistance

 

 

1.9

 

Ω

LCE

Stray Inductance

 

 

 

20

nH

 

RCC’+EE’

Module Lead

Resistance,

Terminal To Chip

 

 

 

0.35

 

 

 

Electrical Characteristics of Diode TC=25 unless otherwise noted

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

VF

Diode Forward

Voltage

IF=400A

Tj=25

 

1.95

2.35

V

Tj=125

 

2.05

 

Qr

Recovered

Charge

IF=400A,

VR=600V,

RG=2.4Ω,

VGE=-15V

Tj=25

 

20.2

 

μC

Tj=125

 

43.0

 

IRM

Peak Reverse

Recovery Current

Tj=25

 

226

 

A

Tj=125

 

340

 

Erec

Reverse Recovery Energy

Tj=25

 

10.1

 

mJ

Tj=125

 

27.2

 

 

Thermal Characteristics

 

Symbol

Parameter

Typ.

Max.

Units

RθJC

Junction-to-Case (per IGBT)

 

0.069

K/W

RθJC

Junction-to-Case (per Diode)

 

0.098

K/W

RθCS

Case-to-Sink (Conductive grease applied)

0.035

 

K/W

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