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GD400HFT120C2SN

IGBT Module,1200V 400A

Brand:
STARPOWER
Spu:
GD400HFT120C2SN
  • Introduction
Introduction

Features

  • Low VCE(sat) trench IGBT technology
  • 10μs short circuit capability
  • VCE(sat) with positive temperature coefficient
  • Maximum junction temperature 175℃
  • Low inductance case
  • Fast & soft reverse recovery anti-parallel FWD
  • Isolated copper baseplate using DBC technology

Typical Applications

  • Inverter for motor drive
  • AC and DC servo drive amplifier
  • Uninterruptible power supply

Absolute Maximum Ratings TC=25 unless otherwise noted

Symbol

Description

GD400HFT120C2SN

Units

VCES

Collector-Emitter Voltage

1200

V

VGES

Gate-Emitter Voltage

±20

V

IC

Collector Current  @ TC=25

@ TC= 100

650

400

A

ICM

Pulsed Collector Current  tp=1ms

800

A

IF

Diode Continuous Forward Current

400

A

IFM

Diode Maximum Forward Current  tp=1ms

800

A

PD

Maximum Power Dissipation  @ Tj=175

2542

W

Tjmax

Maximum Junction Temperature

175

Tjop

Operating Junction Temperature

-40 to +150

TSTG

Storage Temperature Range

-40 to +125

VISO

Isolation Voltage  RMS,f=50Hz,t=1min

4000

V

Mounting Torque

Power Terminal Screw:M6

Mounting Screw:M6

2.5 to 5.0

3.0 to 5.0

N.m

Weight

Weight of Module

300

g

 

 

 

 

Electrical Characteristics of IGBT TC=25 unless otherwise noted

Off Characteristics

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

V(BR)CES

Collector-Emitter

Breakdown Voltage

Tj=25

1200

 

 

V

ICES

Collector Cut-Off

Current

VCE=VCES,VGE=0V, Tj=25

 

 

5.0

mA

IGES

Gate-Emitter Leakage Current

VGE=VGES,VCE=0V, Tj=25

 

 

400

nA

On Characteristics

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

VGE(th)

Gate-Emitter Threshold Voltage

IC= 16.0mA,VCE=VGE, Tj=25

5.0

5.8

6.5

V

 

 

VCE(sat)

 

 

Collector to Emitter

Saturation Voltage

IC=400A,VGE=15V, Tj=25

 

1.70

2.15

 

 

V

IC=400A,VGE=15V, Tj=125

 

2.00

 

IC=400A,VGE=15V, Tj=150

 

2.10

 

Switching Characteristics

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

td(on)

Turn-On Delay Time

 

 

VCC=600V,IC=400A,  RG= 1.8Ω,

VGE=±15V, Tj=25

 

250

 

ns

tr

Rise Time

 

39

 

ns

td(off)

Turn-Off Delay Time

 

500

 

ns

tf

Fall Time

 

100

 

ns

Eon

Turn-On Switching

Loss

 

17.0

 

mJ

Eoff

Turn-Off Switching

Loss

 

42.0

 

mJ

td(on)

Turn-On Delay Time

 

 

VCC=600V,IC=400A,  RG= 1.8Ω,

VGE=±15V, Tj= 125

 

299

 

ns

tr

Rise Time

 

46

 

ns

td(off)

Turn-Off Delay Time

 

605

 

ns

tf

Fall Time

 

155

 

ns

Eon

Turn-On Switching

Loss

 

25.1

 

mJ

Eoff

Turn-Off Switching

Loss

 

61.9

 

mJ

td(on)

Turn-On Delay Time

 

 

VCC=600V,IC=400A,  RG= 1.8Ω,

VGE=±15V, Tj= 150

 

320

 

ns

tr

Rise Time

 

52

 

ns

td(off)

Turn-Off Delay Time

 

625

 

ns

tf

Fall Time

 

180

 

ns

Eon

Turn-On Switching

Loss

 

30.5

 

mJ

Eoff

Turn-Off Switching

Loss

 

66.8

 

mJ

Cies

Input Capacitance

 

VCE=25V,f=1MHz,

VGE=0V

 

28.8

 

nF

Coes

Output Capacitance

 

1.51

 

nF

Cres

Reverse Transfer

Capacitance

 

1.31

 

nF

 

ISC

 

SC Data

tP≤10μs,VGE=15 V,

Tj=125℃,VCC=900V, VCEM≤1200V

 

 

1600

 

 

A

RGint

Internal Gate Resistance

 

 

1.9

 

Ω

LCE

Stray Inductance

 

 

 

20

nH

 

RCC’+EE’

Module Lead

Resistance,

Terminal To Chip

 

 

 

0.35

 

 

Electrical Characteristics of Diode TC=25 unless otherwise noted

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

 

VF

Diode Forward

Voltage

IF=400A,

VGE=0V

Tj=25

 

1.65

2.15

 

V

Tj=125

 

1.65

 

Tj=150

 

1.65

 

 

Qr

 

Recovered Charge

 

 

IF=400A,

VR=600V,

RG= 1.8Ω,

VGE=-15V

Tj=25

 

44

 

 

μC

Tj=125

 

78

 

Tj=150

 

90

 

 

IRM

Peak Reverse

Recovery Current

Tj=25

 

490

 

 

A

Tj=125

 

555

 

Tj=150

 

565

 

 

Erec

Reverse Recovery Energy

Tj=25

 

19.0

 

 

mJ

Tj=125

 

35.1

 

Tj=150

 

38.8

 

 

Thermal Characteristics

 

Symbol

Parameter

Typ.

Max.

Units

RθJC

Junction-to-Case (per IGBT)

 

0.059

K/W

RθJC

Junction-to-Case (per Diode)

 

0.106

K/W

RθCS

Case-to-Sink (Conductive grease applied)

0.035

 

K/W

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