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GD400HFQ120C2SD

IGBT Module,1200V 400A

Brand:
STARPOWER
Spu:
GD400HFQ120C2SD
  • Introduction
Introduction

Features

  • Low VCE(sat) Trench IGBT technology
  • 10μs short circuit capability
  • VCE(sat) with positive temperature coefficient
  • Maximum junction temperature 175oC
  • Low inductance case
  • Fast & soft reverse recovery anti-parallel FWD
  • Isolated copper baseplate using DBC technology

Typical Applications

  • Switching mode power supply
  • Inductive heating
  • Electronic welder

Absolute Maximum Ratings TC=25oC unless otherwise noted

IGBT

 

Symbol

Description

Values

Unit

VCES

Collector-Emitter Voltage

1200

V

VGES

Gate-Emitter Voltage

±20

V

IC

Collector Current  @ TC=25oC

@ TC=100oC

769

400

A

ICM

Pulsed Collector Current  tp=1ms

800

A

PD

Maximum Power Dissipation  @ Tvj  =175oC

2272

W

Diode

Symbol

Description

Values

Unit

VRRM

Repetitive Peak Reverse Voltage

1200

V

IF

Diode Continuous Forward Current

400

A

IFM

Diode Maximum Forward Current  tp=1ms

800

A

 

Module

 

Symbol

Description

Value

Unit

Tvjmax

Maximum Junction Temperature

175

oC

Tvjop

Operating Junction Temperature

-40 to +150

oC

TSTG

Storage Temperature Range

-40 to +125

oC

VISO

Isolation Voltage  RMS,f=50Hz,t=1min

2500

V

 

IGBT Characteristics TC=25oC unless otherwise noted

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

 

 

VCE(sat)

 

 

Collector to Emitter

Saturation Voltage

IC=400A,VGE=15V, Tvj=25oC

 

1.85

2.30

 

 

V

IC=400A,VGE=15V, Tvj=125oC

 

2.25

 

IC=400A,VGE=15V, Tvj=150oC

 

2.35

 

VGE(th)

Gate-Emitter Threshold Voltage

IC=16.00mA,VCE=VGE, Tvj=25oC

5.6

6.2

6.8

V

ICES

Collector Cut-Off

Current

VCE=VCES,VGE=0V,

Tvj=25oC

 

 

1.0

mA

IGES

Gate-Emitter Leakage Current

VGE=VGES,VCE=0V, Tvj=25oC

 

 

400

nA

RGint

Internal Gate Resistance

 

 

0.5

 

Ω

Cies

Input Capacitance

VCE=25V,f=100KHz, VGE=0V

 

43.2

 

nF

Cres

Reverse Transfer

Capacitance

 

1.18

 

nF

QG

Gate Charge

VGE=- 15…+15V

 

3.36

 

μC

td(on)

Turn-On Delay Time

 

 

VCC=600V,IC=400A, RG=2Ω, LS=45nH,

VGE=±15V,Tvj=25oC

 

288

 

ns

tr

Rise Time

 

72

 

ns

td(off)

Turn-Off Delay Time

 

314

 

ns

tf

Fall Time

 

55

 

ns

Eon

Turn-On Switching

Loss

 

43.6

 

mJ

Eoff

Turn-Off Switching

Loss

 

12.4

 

mJ

td(on)

Turn-On Delay Time

 

 

VCC=600V,IC=400A, RG=2Ω, LS=45nH,

VGE=±15V,Tvj=125oC

 

291

 

ns

tr

Rise Time

 

76

 

ns

td(off)

Turn-Off Delay Time

 

351

 

ns

tf

Fall Time

 

88

 

ns

Eon

Turn-On Switching

Loss

 

57.6

 

mJ

Eoff

Turn-Off Switching

Loss

 

17.1

 

mJ

td(on)

Turn-On Delay Time

 

 

VCC=600V,IC=400A, RG=2Ω, LS=45nH,

VGE=±15V,Tvj=150oC

 

293

 

ns

tr

Rise Time

 

78

 

ns

td(off)

Turn-Off Delay Time

 

365

 

ns

tf

Fall Time

 

92

 

ns

Eon

Turn-On Switching

Loss

 

62.8

 

mJ

Eoff

Turn-Off Switching

Loss

 

18.6

 

mJ

 

ISC

 

SC Data

tP≤10μs,VGE=15V,

Tvj=150oC,VCC=800V, VCEM≤1200V

 

 

1500

 

 

A

Diode Characteristics TC=25oC unless otherwise noted

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

 

VF

Diode Forward

Voltage

IF=400A,VGE=0V,Tvj=25oC

 

1.85

2.30

 

V

IF=400A,VGE=0V,Tvj=125oC

 

1.90

 

IF=400A,VGE=0V,Tvj=150oC

 

1.95

 

Qr

Recovered

Charge

 

VR=600V,IF=400A,

-di/dt=4130A/μs,VGE=- 15V, LS=45nH,Tvj=25oC

 

38.8

 

μC

IRM

Peak Reverse

Recovery Current

 

252

 

A

Erec

Reverse Recovery Energy

 

11.2

 

mJ

Qr

Recovered

Charge

 

VR=600V,IF=400A,

-di/dt=3860A/μs,VGE=- 15V, LS=45nH,Tvj=125oC

 

61.9

 

μC

IRM

Peak Reverse

Recovery Current

 

255

 

A

Erec

Reverse Recovery Energy

 

18.7

 

mJ

Qr

Recovered

Charge

 

VR=600V,IF=400A,

-di/dt=3720A/μs,VGE=- 15V, LS=45nH,Tvj=150oC

 

75.9

 

μC

IRM

Peak Reverse

Recovery Current

 

257

 

A

Erec

Reverse Recovery Energy

 

20.5

 

mJ

 

Module Characteristics TC=25oC unless otherwise noted

 

Symbol

Parameter

Min.

Typ.

Max.

Unit

LCE

Stray Inductance

 

 

20

nH

RCC’+EE’

Module Lead Resistance, Terminal to Chip

 

0.35

 

RthJC

Junction-to-Case (per IGBT)

Junction-to-Case (per Diode)

 

 

0.066

0.115

K/W

 

RthCH

Case-to-Heatsink (per IGBT)

Case-to-Heatsink (per Diode)

Case-to-Heatsink (per Module)

 

0.031

0.055

0.010

 

K/W

M

Terminal Connection Torque, Screw M6 Mounting Torque, Screw M6

2.5

3.0

 

5.0

5.0

N.m

G

Weight of Module

 

300

 

g

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