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GD300SGT170C2S

IGBT Module,1700V 300A

Brand:
STARPOWER
Spu:
GD300SGT170C2S
  • Introduction
Introduction

Features

  • Low VCE(sat) Trench IGBT technology
  • Low switching loss
  • 10μs short circuit capability
  • Low inductance case
  • VCE(sat) with positive temperature coefficient
  • Fast & soft reverse recovery anti-parallel FWD
  • Isolated copper baseplate using DBC technology

Typical Applications

  • AC inverter drives
  • Switching mode power supplies
  • UPS

Absolute Maximum Ratings TC=25 unless otherwise noted

Symbol

Description

GD300SGT170C2S

Units

VCES

Collector-Emitter Voltage

1700

V

VGES

Gate-Emitter Voltage

±20

V

IC

Collector Current  @ TC=25

@ TC=80

550

300

A

ICM

Pulsed Collector Current  tp=1ms

600

A

IF

Diode Continuous Forward Current

@ TC=80

300

A

IFM

Diode Maximum Forward Current  tp=1ms

600

A

PD

Maximum Power Dissipation  @ Tj=175

2239

W

Tjmax

Maximum Junction Temperature

175

TSTG

Storage Temperature Range

-40 to +125

VISO

Isolation Voltage  RMS,f=50Hz,t=1min

4000

V

Mounting Torque

Power Terminal Screw:M4

Power Terminal Screw:M6

1.1 to 2.0

2.5 to 5.0

N.m

Mounting Screw:M6

3.0 to 5.0

N.m

 

Electrical Characteristics of IGBT TC=25 unless otherwise noted

Off Characteristics

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

V(BR)CES

Collector-Emitter

Breakdown Voltage

Tj=25

1700

 

 

V

ICES

Collector Cut-Off

Current

VCE=VCES,VGE=0V, Tj=25

 

 

5.0

mA

IGES

Gate-Emitter Leakage Current

VGE=VGES,VCE=0V, Tj=25

 

 

400

nA

On Characteristics

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

VGE(th)

Gate-Emitter Threshold Voltage

IC= 12.0mA,VCE=VGE, Tj=25

5.2

5.8

6.4

V

 

VCE(sat)

 

Collector to Emitter

Saturation Voltage

IC=300A,VGE=15V, Tj=25

 

2.00

2.45

 

V

IC=300A,VGE=15V, Tj=125

 

2.40

 

Switching Characteristics

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

td(on)

Turn-On Delay Time

 

 

VCC=900V,IC=300A,  RG=4.7Ω,VGE=±15V, Tj=25

 

281

 

ns

tr

Rise Time

 

82

 

ns

td(off)

Turn-Off Delay Time

 

801

 

ns

tf

Fall Time

 

121

 

ns

Eon

Turn-On Switching

Loss

 

70.0

 

mJ

Eoff

Turn-Off Switching

Loss

 

65.0

 

mJ

td(on)

Turn-On Delay Time

 

 

VCC=900V,IC=300A,  RG=4.7Ω,VGE=±15V, Tj=125

 

303

 

ns

tr

Rise Time

 

103

 

ns

td(off)

Turn-Off Delay Time

 

1002

 

ns

tf

Fall Time

 

203

 

ns

Eon

Turn-On Switching

Loss

 

105

 

mJ

Eoff

Turn-Off Switching

Loss

 

94.0

 

mJ

Cies

Input Capacitance

VCE=25V,f=1MHz,

VGE=0V

 

26.6

 

nF

Coes

Output Capacitance

 

1.11

 

nF

Cres

Reverse Transfer

Capacitance

 

0.88

 

nF

 

ISC

 

SC Data

tP≤10μs,VGE=15 V,

Tj=125℃,VCC= 1000 V, VCEM≤1700V

 

 

1200

 

 

A

RGint

Internal Gate Resistance

 

 

2.1

 

Ω

LCE

Stray Inductance

 

 

 

20

nH

 

RCC’+EE’

Module Lead

Resistance,

Terminal To Chip

 

 

 

0.18

 

Electrical Characteristics of DIODE TC=25 unless otherwise noted

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

VF

Diode Forward

Voltage

IF=300A

Tj=25

 

1.80

2.20

V

Tj=125

 

1.90

 

Qr

Recovered

Charge

IF=300A,

VR=900V,

RG=4.7Ω,

VGE=-15V

Tj=25

 

77

 

μC

Tj=125

 

131

 

IRM

Peak Reverse

Recovery Current

Tj=25

 

351

 

A

Tj=125

 

383

 

Erec

Reverse Recovery Energy

Tj=25

 

40.0

 

mJ

Tj=125

 

72.0

 

Thermal Characteristics

Symbol

Parameter

Typ.

Max.

Units

RθJC

Junction-to-Case (per IGBT)

 

0.067

K/W

RθJC

Junction-to-Case (per DIODE)

 

0.124

K/W

RθCS

Case-to-Sink (Conductive grease applied)

0.035

 

K/W

Weight

Weight     Module

300

 

g

 

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