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IGBT Module 1700V

IGBT Module 1700V

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GD300HFT170C2S,IGBT Module,STARPOWER

1700V 300A

Brand:
STARPOWER
Spu:
GD300HFT170C2S
  • Introduction
  • Outline
Introduction

Brief introduction

IGBT module, produced by STARPOWER. 1700V 300A.

Features

  • Low VcE(sat)trench IGBT technology
  • Low switching losses
  • 10us short circuit capability
  • VcE(sat) with positive temperature coefficient
  • Low inductance case
  • Fast & soft reverse recovery anti-parallel FWD
  • Isolated copper baseplate using DBC technology

Typical Applications

  • AC inverter drives mains 575-750V AC
  • Public transport(auxiliary syst.)

Absolute Maximum Ratings Te=25℃ unless otherwise noted

Symbol

Description

GD300HFT170C2S

Units

Vces

Collector-Emitter Voltage

1700

V

VGFs

Gate-Emitter Voltage

±20

V

Ic

Collector Current @Tc=25℃

@Tc=80℃

550

A

300

IcM(1)

Pulsed Collector Current tp=1ms

600

A

Ir

Diode Continuous Forward Current

300

A

IM

Diode Maximum Forward Current

600

A

Pp

Maximum Power Dissipation @Tj=175℃

2083

W

Tsc

Short Circuit Withstand Time @Tj=125℃

10

μs

Tjmax

Maximum Junction Temperature

175

TsTG

Storage Temperature Range

-40 to+125

I²t-value,Diode

VR=0V,t=10ms,Tj=125℃

14500

A²s

Viso

Isolation Voltage RMS,f=50Hz,t=1min

4000

V

Mounting Torque

Power Terminal Screw:M6

2.5 to 5.0

N.m

Mounting Screw:M6

3.0 to 5.0

N.m

Electrical Characteristics of IGBT Te=25℃ unless otherwise noted

Off Characteristics

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

BVcrs

Collector-Emitter

Breakdown Voltage

VGe=0V,Ic=4.0mA, T=25℃

1700

V

IcEs

Collector Cut-Off Current

Vce=VcEs,VGE=0V, Tj=25℃

3.0

mA

IGrs

Gate-Emitter Leakage Current

VGr=VGes,Vcn=0V, T=25℃

400

nA

On Characteristics

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

Vcπ(h)

Gate-Emitter Threshold Voltage

Ie=12.0mA,Vcr=VGE T=25℃

5.2

5.8

6.4

V

VCE(sat)

Collector to Emitter Saturation Voltage

Ic=300A,VGr=15V, T=25℃

2.0

V

Ic=300A,VGr=15V. T=125℃

2.4

Switching Characteristics

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

taon)

Turn-On Delay Time

Vcc=900V,Ic=300A, Ra=4.72,

Vae=±15V, T=25℃

281

ns

t

Rise Time

82

ns

ta(o)

Turn-Off Delay Time

801

ns

tr

Fall Time

Vcc=900V,Ic=300A,

Rc=4.72,

V=±15V

T=25℃

121

ns

Eon

Turn-On Switching

Loss

70

mJ

Eofr

Turn-Off Switching

Loss

65

mJ

ta(on)

Turn-On Delay Time

Vcc=900V,Ic=300A,

RG=4.72,

Vc=±15V T=125℃

303

ns

t

Rise Time

103

ns

ta(om)

Turn-Off Delay Time

1002

ns

tr

Fall Time

203

ns

Eon

Turn-On Switching

Loss

105

mJ

Eor

Turn-Off Switching

Loss

94

mJ

Cies

Input Capacitance

Vce=25V,f=1MHz,

VGr=0V

27.0

nF

Coes

Output Capacitance

1.1

nF

Cres

Reverse Transfer

Capacitance

0.9

nF

Isc

SC Data

tsc≤10μs,VGE=15V,

T=125℃,

Vcc=1000V

VcrM≤1700V

1200

A

RGint

Internal Gate Resistance

2.5

Ω

LCr

Stray Inductance

20

nH

RcC'+EE'

Module Lead Resistance, Terminal to Chip

Tc=25℃

0.35

m2

Electrical Characteristics of DIODE Tc=25℃ unless otherwise noted

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

Vr

Diode Forward

Voltage

Iq=300A

Tj=25℃

1.8

V

Ti=125℃

1.9

Q

Diode Reverse

Recovery Charge

Ir=300A,

Vr=900V,

di/dt=-3600A/μs,

VGr=-15V

T=25℃

77

μC

Tj=125℃

131

IRM

Diode Peak

Reverse Recovery Current

Tj=25℃

351

A

T=125℃

383

Eree

Reverse Recovery Energy

Tj=25℃

40

mJ

Tj=125℃

72

Thermal Characteristics

Symbol

Parameter

Typ.

Max.

Units

Rac

Junction-to-Case (IGBT Part, per 1/2 Module)

0.072

K/W

Rac

Junction-to-Case (DIODE Part, per 1/2 Module)

0.13

K/W

Roc

Case-to-Sink (Conductive grease applied)

0.035

K/W

Weight

Weight of Module

300

g

Outline

image(c3756b8d25).png

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