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GD300HFT170C2S

IGBT Module,1700V 300A

Brand:
STARPOWER
Spu:
GD300HFT170C2S
  • Introduction
Introduction

Features

  • Low VcE(sat)trench IGBT technology
  • Low switching losses
  • 10us short circuit capability
  • VcE(sat) with positive temperature coefficient
  • Low inductance case
  • Fast & soft reverse recovery anti-parallel FWD
  • Isolated copper baseplate using DBC technology

 

Typical Applications

  • AC inverter drives mains 575-750V AC
  • Public transport(auxiliary syst.)

Absolute Maximum Ratings Te=25℃ unless otherwise noted

 

Symbol

Description

GD300HFT170C2S

Units

Vces

Collector-Emitter Voltage

1700

V

VGFs

Gate-Emitter Voltage

±20

V

Ic

Collector Current @Tc=25℃

@Tc=80℃

550

A

300

IcM(1)

Pulsed Collector Current tp=1ms

600

A

Ir

Diode Continuous Forward Current

300

A

IM

Diode Maximum Forward Current

600

A

Pp

Maximum Power Dissipation @Tj=175℃

2083

W

Tsc

Short Circuit Withstand Time @Tj=125℃

10

μs

Tjmax

Maximum Junction Temperature

175

TsTG

Storage Temperature Range

-40 to+125

I²t-value,Diode

VR=0V,t=10ms,Tj=125℃

14500

A²s

Viso

Isolation Voltage RMS,f=50Hz,t=1min

4000

V

Mounting Torque

Power Terminal Screw:M6

2.5 to 5.0

N.m

Mounting  Screw:M6

3.0 to 5.0

N.m

 

Electrical Characteristics of IGBT Te=25℃ unless otherwise noted

Off Characteristics

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

BVcrs

Collector-Emitter

Breakdown Voltage

VGe=0V,Ic=4.0mA, T=25℃

1700

 

 

V

IcEs

Collector Cut-Off Current

Vce=VcEs,VGE=0V, Tj=25℃

 

 

3.0

mA

IGrs

Gate-Emitter Leakage Current

VGr=VGes,Vcn=0V, T=25℃

 

 

400

nA

On Characteristics

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

Vcπ(h)

Gate-Emitter Threshold Voltage

Ie=12.0mA,Vcr=VGE T=25℃

5.2

5.8

6.4

V

 

VCE(sat)

 

Collector to Emitter Saturation Voltage

Ic=300A,VGr=15V, T=25℃

 

2.0

 

 

V

Ic=300A,VGr=15V. T=125℃

 

2.4

 

Switching Characteristics

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

taon)

Turn-On Delay Time

Vcc=900V,Ic=300A, Ra=4.72,

Vae=±15V, T=25℃

 

281

 

ns

t

Rise Time

 

82

 

ns

ta(o)

Turn-Off Delay Time

 

801

 

ns

tr

Fall Time

 

Vcc=900V,Ic=300A, 

Rc=4.72,

V=±15V

T=25℃

 

121

 

ns

Eon

Turn-On Switching

Loss

 

70

 

mJ

Eofr

Turn-Off Switching

Loss

 

65

 

mJ

ta(on)

Turn-On Delay Time

 

 

 

Vcc=900V,Ic=300A,

RG=4.72,

Vc=±15V T=125℃

 

303

 

ns

t

Rise Time

 

103

 

ns

ta(om)

Turn-Off Delay Time

 

1002

 

ns

tr

Fall Time

 

203

 

ns

Eon

Turn-On Switching

Loss

 

105

 

mJ

Eor

Turn-Off Switching

Loss

 

94

 

mJ

Cies

Input Capacitance

 

Vce=25V,f=1MHz,

VGr=0V

 

27.0

 

nF

Coes

Output Capacitance

 

1.1

 

nF

Cres

Reverse Transfer

Capacitance

 

0.9

 

nF

 

Isc

 

SC Data

tsc≤10μs,VGE=15V, 

T=125℃,

Vcc=1000V

VcrM≤1700V

 

 

1200

 

 

A

RGint

Internal Gate Resistance

 

 

2.5

 

Ω

LCr

Stray Inductance

 

 

 

20

nH

RcC'+EE'

Module Lead Resistance, Terminal to Chip

Tc=25℃

 

0.35

 

m2

 

Electrical Characteristics of DIODE Tc=25℃ unless otherwise noted

 

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Units

Vr

Diode Forward

Voltage

Iq=300A

Tj=25℃

 

1.8

 

V

Ti=125℃

 

1.9

 

Q

Diode Reverse

Recovery Charge

 

 

Ir=300A,

Vr=900V,

di/dt=-3600A/μs,

VGr=-15V

T=25℃

 

77

 

μC

Tj=125℃

 

131

 

 

IRM

Diode Peak

Reverse Recovery Current

Tj=25℃

 

351

 

 

A

T=125℃

 

383

 

Eree

Reverse Recovery Energy

Tj=25℃

 

40

 

mJ

Tj=125℃

 

72

 

Thermal Characteristics

 

Symbol

Parameter

Typ.

Max.

Units

Rac

Junction-to-Case (IGBT Part, per 1/2 Module)

 

0.072

K/W

Rac

Junction-to-Case (DIODE Part, per 1/2 Module)

 

0.13

K/W

Roc

Case-to-Sink (Conductive grease applied)

0.035

 

K/W

Weight

Weight of Module

300

 

g

 

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