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IGBT Module 1700V

IGBT Module 1700V

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GD300HFL170C6S,IGBT Module,STARPOWER

IGBT Module,1700A 300A

Brand:
STARPOWER
Spu:
GD300HFL170C6S
  • Introduction
  • Outline
Introduction

Brief introduction

IGBT module, produced by STARPOWER. 1700V 300A.

Features

  • Low VCE(sat) SPT+ IGBT technology
  • 10μs short circuit capability
  • VCE(sat) with positive temperature coefficient
  • Maximum junction temperature 175oC
  • Low inductance case
  • Fast & soft reverse recovery anti-parallel FWD
  • Isolated copper baseplate using DBC technology

Typical Applications

  • Inverter for motor drive
  • AC and DC servo drive amplifier
  • Uninterruptible power supply

Absolute Maximum Ratings TC=25oC unless otherwise noted

IGBT

Symbol

Description

Value

Unit

VCES

Collector-Emitter Voltage

1700

V

VGES

Gate-Emitter Voltage

±20

V

IC

Collector Current @ TC=25oC

@ TC= 100oC

490

300

A

ICM

Pulsed Collector Current tp=1ms

600

A

PD

Maximum Power Dissipation @ T =175oC

2027

W

Diode

Symbol

Description

Value

Unit

VRRM

Repetitive Peak Reverse Voltage

1700

V

IF

Diode Continuous Forward Current

300

A

IFM

Diode Maximum Forward Current tp=1ms

600

A

Module

Symbol

Description

Value

Unit

Tjmax

Maximum Junction Temperature

175

oC

Tjop

Operating Junction Temperature

-40 to +150

oC

TSTG

Storage Temperature Range

-40 to +125

oC

VISO

Isolation Voltage RMS,f=50Hz,t=1min

4000

V

IGBT Characteristics TC=25oC unless otherwise noted

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

VCE(sat)

Collector to Emitter

Saturation Voltage

IC=300A,VGE=15V, Tj=25oC

2.40

2.85

V

IC=300A,VGE=15V, Tj=125oC

2.80

IC=300A,VGE=15V, Tj=150oC

2.90

VGE(th)

Gate-Emitter Threshold Voltage

IC= 12.0mA,VCE=VGE, Tj=25oC

5.4

6.2

7.4

V

ICES

Collector Cut-Off

Current

VCE=VCES,VGE=0V,

Tj=25oC

1.0

mA

IGES

Gate-Emitter Leakage Current

VGE=VGES,VCE=0V, Tj=25oC

400

nA

Cies

Input Capacitance

VCE=25V,f=1MHz,

VGE=0V

20.3

nF

Cres

Reverse Transfer

Capacitance

0.69

nF

QG

Gate Charge

VGE=- 15…+15V

2.31

μC

td(on)

Turn-On Delay Time

VCC=900V,IC=300A, RG=4.7Ω,

VGE=±15V, Tj=25oC

200

ns

tr

Rise Time

97

ns

td(off)

Turn-Off Delay Time

410

ns

tf

Fall Time

370

ns

Eon

Turn-On Switching

Loss

82.0

mJ

Eoff

Turn-Off Switching

Loss

60.0

mJ

td(on)

Turn-On Delay Time

VCC=900V,IC=300A, RG=4.7Ω,

VGE=±15V, Tj= 125oC

250

ns

tr

Rise Time

99

ns

td(off)

Turn-Off Delay Time

630

ns

tf

Fall Time

580

ns

Eon

Turn-On Switching

Loss

115

mJ

Eoff

Turn-Off Switching

Loss

90.0

mJ

td(on)

Turn-On Delay Time

VCC=900V,IC=300A, RG=4.7Ω,

VGE=±15V, Tj= 150oC

260

ns

tr

Rise Time

105

ns

td(off)

Turn-Off Delay Time

670

ns

tf

Fall Time

640

ns

Eon

Turn-On Switching

Loss

125

mJ

Eoff

Turn-Off Switching

Loss

100

mJ

ISC

SC Data

tP≤10μs,VGE=15V,

Tj=150oC,VCC= 1000V, VCEM≤1700V

1200

A

Diode Characteristics TC=25oC unless otherwise noted

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

VF

Diode Forward

Voltage

IF=300A,VGE=0V,Tj=25oC

1.80

2.25

V

IF=300A,VGE=0V,Tj= 125oC

1.95

IF=300A,VGE=0V,Tj= 150oC

1.90

Qr

Recovered Charge

VR=900V,IF=300A,

-di/dt=2800A/μs,VGE=- 15V Tj=25oC

90.0

μC

IRM

Peak Reverse

Recovery Current

270

A

Erec

Reverse Recovery Energy

45.0

mJ

Qr

Recovered Charge

VR=900V,IF=300A,

-di/dt=2800A/μs,VGE=- 15V Tj= 125oC

135

μC

IRM

Peak Reverse

Recovery Current

315

A

Erec

Reverse Recovery Energy

75.5

mJ

Qr

Recovered Charge

VR=900V,IF=300A,

-di/dt=2800A/μs,VGE=- 15V Tj= 150oC

160

μC

IRM

Peak Reverse

Recovery Current

330

A

Erec

Reverse Recovery Energy

84.0

mJ

NTC Characteristics TC=25oC unless otherwise noted

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

R25

Rated Resistance

5.0

∆R/R

Deviation of R100

TC= 100oC,R100=493.3Ω

-5

5

%

P25

Power Dissipation

20.0

mW

B25/50

B-value

R2=R25exp[B25/50(1/T2-

1/(298.15K))]

3375

K

Module Characteristics TC=25oC unless otherwise noted

Symbol

Parameter

Min.

Typ.

Max.

Unit

LCE

Stray Inductance

20

nH

RCC’+EE’

Module Lead Resistance, Terminal to Chip

1.10

RθJC

Junction-to-Case (per IGBT)

Junction-to-Case (per Diode)

0.074

0.121

K/W

RθCS

Case-to-Sink (per IGBT)

Case-to-Sink (per Diode)

0.029

0.047

K/W

RθCS

Case-to-Sink

0.009

K/W

M

Terminal Connection Torque, Screw M5 Mounting Torque, Screw M6

3.0

3.0

6.0

6.0

N.m

G

Weight Module

350

g

Outline

image(c537ef1333).png

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